As the industry pushes the boundaries of technology to meet the demands of high-performance devices in areas like artificial intelligence, 5G, and high-bandwidth memory, new developments in bonding processes and packaging technologies are playing a key role. These advancements are not only improving the efficiency and scalability of semiconductor devices but are also driving down costs, making cutting-edge technology more accessible across various sectors.
Shubham Ekatpure has emerged as a pivotal figure in the development of advanced equipment solutions for 3D packaging, particularly in the areas of flip-chip technology and bonding processes such as thermo-compression, chip-to-wafer, and wafer-to-wafer bonding. Currently serving as a Staff Engineer in Research and Development at Kulicke and Soffa Industries—a global leader in wire bonding and ball bonding technologies—Shubham collaborates with industry Fabs and OSAT giants in the USA. His work focuses on innovating and refining bonding processes essential for cutting-edge 3D IC packaging solutions. These innovations are crucial for delivering the increased performance and density required in modern electronics, enabling more powerful and compact devices.
In his role, Shubham has been instrumental in deploying global supply chains for five advanced packaging equipment, working closely with over 200 suppliers worldwide. His efforts have driven significant innovation in 3D IC packaging technologies, particularly through the development of critical components such as bonding heaters, ceramic chucks, IC packaging wafers and substrate handlers, and plasma gases. Managing a $100 million spend at Kulicke and Soffa Industries, he has achieved notable cost savings through strategic innovation, close supplier partnerships, and advanced technological approaches that prioritize efficiency.
Among his most significant projects are the development of Thermo Compression Bonders, including the Flip Chip Bonder, Chip to Wafer Bonder, and the series of Wafer to Wafer and Tray to Wafer Bonders. These products have advanced the industry by achieving bonding pitches in nanometers, particularly for major players like Intel, contributing to more compact and high-performance semiconductor devices.
Ekatpure has also pioneered the supply chain development of the industry's first fluxless bonding technology, which has demonstrated exceptional results for leading fabs and OSATs. This innovation represents a significant leap forward in semiconductor manufacturing processes, optimizing production and enhancing the overall efficiency of the industry. This fluxless approach eliminates contaminants, leading to cleaner and more reliable connections, which are crucial for maintaining high performance in densely packed 3D ICs.
While much of his work remains confidential, due to the proprietary nature of his collaborations with customers, his contributions continue to drive the advancement of semiconductor technology. He remains focused on the future, particularly on hybrid bonding, which he views as a critical enabler for the semiconductor industry's evolution. As demand grows for high-performance devices in areas like AI, 5G, and high-bandwidth memory, Shubham Ekatpure believes that hybrid bonding's ability to create fine-pitch interconnections will be crucial in delivering superior power efficiency, performance, and scalability. This low-temperature copper bonding technology is poised to become a cornerstone of next-generation semiconductor devices, driving future innovations as the ecosystem and manufacturing processes continue to mature.
The advancements in 3D IC packaging, led by innovators like Shubham Ekatpure, are propelling the semiconductor industry into a new era of performance and efficiency. These technologies are not only setting new standards in power efficiency and scalability but also enabling the creation of smaller, faster, and more reliable devices. As hybrid bonding and fluxless technologies continue to evolve, they will play an indispensable role in meeting the growing demands of AI, 5G, and beyond, ensuring that cutting-edge semiconductor devices remain at the forefront of global technological advancements.
This content is produced by Rahul Sharma.
